Radiation Cured Parts : Impact of Semiconductor Wafer Cleaning
Ashwin Chockalingam, Rajeev Bajaj, Applied Materials, Inc.
Abstract: Radiation curing provides the productivity and cost effectiveness necessary to enable functional parts for semiconductor wafer processing industry. The property isotropy achieved through UV cured parts is of specific interest to ensure process repeatability through structural wear from various unit processes. Cleaning is one such unit process which acts a key enabler for fabrication of semiconductor devices. The deployment of photo curable resins with specific surface charge moieties as clean brushes is a topic of recent interest. In this paper, we will show the physical and chemical characteristics of these systems and challenges associated with enabling them.