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Tuesday, May 8, 2018


Introduction to the Basics of UV/EB Curing
Dr. Mike J. Idacavage, Colorado Photopolymer Solutions


8:00-10:00 AM - Printing + Packaging I

Bisphenol A Free Resin Options for Inks and Overprint Varnishes
Jo Ann Arceneaux, Allnex USA, Inc.

Overcoming challenges of LED in graphic arts applications
Anna Johnson, Sartomer

Nestle Compliant Chemistries to Enable Next Generation Formulations
James Goodrich, Miwon North America

UV LED Flexographic Printing
Jennifer Heathcote, Phoseon Technology

1:15 - 3:15 PM - UV LED I

Improved Curing Solutions with LED Wavelengths below 365nm
Mike Kay, Excelitas Technologies

Raw Material Selection Considerations for UV/LED Applications
Michael Gould, RAHN USA

Curing Traditional Formulations with Multi-Wavelength LEDs
Brett Skinner, Heraeus Noblelight America

The Effects of UV Glass Optics on UV LED Arrays
Brian Jasenak, Kopp Glass


8:00-10:00 AM - Coatings

Develop Functional films and R2R Process
Nizamidin Jappar, Kimoto Tech Inc

Cure Speed Measurements of UV-LED Curable Optical Fiber Coatings
Xiaosong Wu, DSM Functional Materials

Guns vs. Bells - What's the Best Way to Apply My UV Cure Coating?
Michael Bonner, Saint Clair Systems, Inc.

UV Energy Cure for Formable Hard-Coated Polymeric Film & Sheet
Bruce K Bachman, CSI Group of Companies

10:15-12:15 PM - Formulation

A Bright Future for Light-Cured Composite Materials
Alan J. Jacobsen, Light Composites LLC

Thiol Chemistry: Past and Progress
Jon Scholte, Sartomer

Controlling Viscosity of Spray Applied Coatings While Considering Environmental Compliance
Kristy Wagner, Red Spot Paint and Varnish

POSS Coating Additives: Epoxy and Acrylic Tool Kits
Joe Lichtenhan, Hybrid Plastics Inc.

Exhibit Theater

10:15 - 11:00 AM - The Future of Manufacturing and Customer Use in the Automotive Industry

Confirmed panelists:

  • Chris Seubert, Ford Motor Co.
  • Peter Votruba-Drzal, PPG
  • Mary Ellen Rosenberger, BaySpring Solutions

1:15 - 3:15 PM - Electron Beam for Packaging

Application of EB Curing in Tobacco Packaging in China
Vincent LUO, CGN Dasheng Electron Accelerator Technology Co. Ltd.

Current State and Unmet Performance Needs of the Flexible Packaging Market
Kelly Williams, Futamura

Panel Discussion Featuring:

  • Todd Fayne, Pepsico
  • Im Rangwalla, ESI Vincent LUO, CGN Dasheng Electron Accelerator Technology Co. Ltd.
  • Vincent LUO, CGN Dasheng Electron Accelerator Technology Co. Ltd.
  • Kelly Williams, Futamura
  • Wang Hui, China Tobacco Zhejiang Industrial Co., Ltd

3:30 - 4:15 PM - Panel: 3D Printing

Confirmed Panelists:

  • Maximilian Zieringer, Formlabs
  • Mike Idacavage, Colorado Photopolymer Solutions
  • Jo Ann Arceneaux, Allnex
  • More Announced Soon!


10:15-12:15 PM - New Product Debut II

Oligomer Selection for Flexible 3D Printing Resins
David Robitaille, Dymax

Advanced resins for advancing Radcure innovations in flooring, automotive and graphics sectors
Scott Auger, Allnex

Cationic UV Solutions
David Zopf, Nagase America Corporation

High Power UV-LED Illuminators for DLP® Digital Exposure Applications; 3D Printing and Lithography
Kevin Carr, Innovations in Optics, Inc. 

Ushio Unijet Series UV LED
Michael Hughes, Ushio

UV LED Optic Design Lab
Sharayah Campbell, Kopp Glass

Light Hammer Mark III: The Next Generation - energy efficient, smart and Industry 4.0 ready
Kevin Joesel, Heraeus Noblelight America LLC

SEMRAY: The scalable LED platform with Industry 4.0 capability
Lonnie Murphy, Heraeus Noblelight America LLC

1:15 - 3:15 - RadLaunch Presentations

3:30 - 5:30 - New Technology Session


6935 Wisconsin Ave., Suite 207 · Chevy Chase, MD 20815 · 240-497-1242 · 240-643-0517

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